Página 6 - Sockets for ICs, Transistors - Adapters | Conectores, interconectores | Heisener Electronics
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Sockets for ICs, Transistors - Adapters

Registros 353
Página  6/13
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
64-304121-00
Aries Electronics

SOCKET ADAPTER TQFP TO 64QFP

  • Convert From (Adapter End): TQFP
  • Convert To (Adapter End): QFP
  • Number of Pins: 64
  • Pitch - Mating: 0.031" (0.80mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.031" (0.80mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias2.736
QFP
64
0.031" (0.80mm)
-
Through Hole
Solder
0.031" (0.80mm)
Tin-Lead
-
FR4 Epoxy Glass
DS9075-40V/NO-BRAND
Maxim Integrated

SOCKET ADAPTER SIP TO 40DIP

  • Convert From (Adapter End): SIP
  • Convert To (Adapter End): DIP
  • Number of Pins: 40
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias6.840
DIP
40
-
-
-
-
-
-
-
-
44-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 44
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias7.434
DIP, 0.6" (15.24mm) Row Spacing
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-653000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias2.196
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
95-132I25-P
Aries Electronics

SOCKET ADAPTER QFP TO 132PGA

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 132
  • Pitch - Mating: 0.025" (0.64mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias2.898
PGA
132
0.025" (0.64mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias5.940
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
PA-SOD6SM18-44
Logical Systems Inc.

ADAPTER 44SOIC TO 44DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 44
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias2.934
DIP
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
28-650000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias7.956
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
14-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Paquete: -
En existencias3.366
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-665000-00
Aries Electronics

SCK ADAPT 8P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias7.758
SOIC
8
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-301550-20
Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): PLCC
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias4.446
PLCC
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
10-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 10DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 10
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Paquete: -
En existencias7.128
DIP, 0.3" (7.62mm) Row Spacing
10
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
22-304504-18
Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.4

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 22
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias6.822
DIP, 0.4" (10.16mm) Row Spacing
22
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Paquete: -
En existencias4.554
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
08-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Paquete: -
En existencias7.848
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
1111841-8
Aries Electronics

SOCKET ADAPTER MSOP TO 8DIP 0.3

  • Convert From (Adapter End): MSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias3.924
DIP, 0.3" (7.62mm) Row Spacing
8
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
14-350000-11-RC-P
Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Paquete: -
En existencias8.694
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
20-350000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Paquete: -
En existencias2.412
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
PA-TS1D6SM18-32
Logical Systems Inc.

ADAPTER 32TSOP TO 32DIP

  • Convert From (Adapter End): TSOP
  • Convert To (Adapter End): DIP
  • Number of Pins: 32
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias8.532
DIP
32
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-SSD6SM18-40
Logical Systems Inc.

ADAPTER 40TSSOP TO 40DIP

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP
  • Number of Pins: 40
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias8.820
DIP
40
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
220-3342-19-0602J
3M

RECEPTACLE DIP SOCKET 20POS .3"

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias4.950
-
-
-
-
-
-
-
-
-
-
224-1275-19-0602J
3M

RECEPTACLE DIP SOCKET 24POS .6"

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias7.596
-
-
-
-
-
-
-
-
-
-
16-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias6.264
DIP, 0.3" (7.62mm) Row Spacing
16
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
PA-SOD3SM18-18
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 18DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias6.048
DIP
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
LCQT-QFP0.5-64
Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 64
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias7.434
QFP
64
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
PA-SOTD3SM18-06
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 6DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 6
  • Pitch - Mating: 0.037" (0.95mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias7.254
DIP
6
0.037" (0.95mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-SSD3SM18-08
Logical Systems Inc.

SOCKET ADAPTER SSOP TO 8DIP

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Paquete: -
En existencias7.326
DIP
8
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
1109814
Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): JEDEC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias14.616
JEDEC
8
0.050" (1.27mm)
-
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass