Página 26 - Integrado - microcontrolador, microprocesador, módulos FPGA | Circuitos integrados | Heisener Electronics
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Integrado - microcontrolador, microprocesador, módulos FPGA

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Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
DLP-HS-FPGA
DLP Design Inc.

MODULE USB-TO-FPGA SPARTAN3

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-3A, XC3S200A
  • Co-Processor: FT2232H
  • Speed: 66MHz
  • Flash Size: -
  • RAM Size: 32MB
  • Connector Type: USB - B, Pin Header
  • Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias7.088
Spartan-3A, XC3S200A
FT2232H
66MHz
-
32MB
USB - B, Pin Header
3" x 1.2" (76.2mm x 30.5mm)
0°C ~ 70°C
COMMPC8360E-10-2752FCR
Logic

KIT 256MB DDR 8MB NOR 64MB NAND

  • Module/Board Type: MPU Core
  • Core Processor: PowerQUICC, MPC8360E
  • Co-Processor: -
  • Speed: 667MHz
  • Flash Size: 64MB (NAND), 8MB (NOR)
  • RAM Size: 256KB
  • Connector Type: -
  • Size / Dimension: 3.74" x 3.74" (95mm x 95mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias6.800
PowerQUICC, MPC8360E
-
667MHz
64MB (NAND), 8MB (NOR)
256KB
-
3.74" x 3.74" (95mm x 95mm)
0°C ~ 70°C
M5474GFE
NXP

MODULE M5474 FIRE ENGINE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias3.952
-
-
-
-
-
-
-
-
CENGLH7A400-10-402HI
Logic

CARD ENGINE 32MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM922T, LH7A400
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias7.632
ARM922T, LH7A400
-
200MHz
16MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
-40°C ~ 85°C
101-0672
Digi International

MODULE RABBITCORE RCM3600

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: IDC Header 2x20
  • Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias6.912
Rabbit 3000
-
22.1MHz
512KB
512KB
IDC Header 2x20
1.23" x 2.11" (31mm x 54mm)
-40°C ~ 85°C
101-0436
Digi International

MODULE RABBITCORE RCM2120

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 2000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: 2 IDC Headers 2x20
  • Size / Dimension: 2" x 3.5" (51mm x 89mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias4.992
Rabbit 2000
-
22.1MHz
512KB
512KB
2 IDC Headers 2x20
2" x 3.5" (51mm x 89mm)
-40°C ~ 85°C
DC-SP-01-C-25
Digi International

ADAPTER SP CUSTOMIZABLE MODEL

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: RJ45
  • Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias4.816
ARM7TDMI, NS7520
-
55MHz
4MB
16MB
RJ45
3.88" x 1.68" (98.5mm x 42.7mm)
-40°C ~ 85°C
CC-MX-LD69-ZM-B
Digi International

MODULE I.MX53 512MB FLASH 25PK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias7.952
-
-
-
-
-
-
-
-
CC-MX-MB47-ZM
Digi International

MODULE I.MX51 600MHZ 128MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias6.768
-
-
-
-
-
-
-
-
CC-9M-NA49-Z1
Digi International

MOD 9M 128MB SDRAM 512MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM920T, SC2443
  • Co-Processor: -
  • Speed: 533MHz
  • Flash Size: 512MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias4.976
ARM920T, SC2443
-
533MHz
512MB
128MB
Board-to-Board (BTB) Socket - 240
2.36" x 1.73" (60mm x 44mm)
-40°C ~ 85°C
TE0711-01-100-2I
Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2I

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias6.640
Artix-7 A100T
-
100MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
DC-ME-Y402-TSB-1
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias5.712
-
-
-
-
-
-
-
-
TE0803-02-04CG-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
En existencias2.704
Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
TE0820-05-4DI81MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
TE0808-04-9BE21-AK
Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB ZU9EG-E

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Zynq UltraScale+ XCZU9EG-1FFVC900E
-
-
128MB
2GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C
TE0820-04-2BI21FL
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Zynq UltraScale+ XCZU2EG-1SFVC784I
-
-
128MB
2GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0726-03-41C74-Q
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: CSI, DSI
  • Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7010)
-
16MB
128MB
CSI, DSI
1.180" L x 1.570" W (30.00mm x 40.00mm)
0°C ~ 70°C
6254-TX-X9E-RC
Critical Link LLC

SOM WITH TI SITARA AM6254, 1.4GH

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: NEON SIMD
  • Speed: 1.4GHz
  • Flash Size: 32GB eMMC
  • RAM Size: 4GB
  • Connector Type: SO-DIMM-260
  • Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM® Cortex®-A53
NEON SIMD
1.4GHz
32GB eMMC
4GB
SO-DIMM-260
2.740" L x 1.500" W (69.60mm x 38.10mm)
0°C ~ 70°C
M100PF-1AC
ARIES Embedded

SoM PolarFire FPGA MPF100T

  • Module/Board Type: FPGA
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
-
-
-
-
1GB
Board-to-Board (BTB) Socket
2.910" L x 1.650" W (74.00mm x 42.00mm)
0°C ~ 70°C
TE0745-02-81C31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7035)
-
64MB
1GB
Board-to-Board (BTB) Socket - 160
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0720-03-62I33ML
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 8GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
8GB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
EC-V-H264-8B-30-1080-MXC-LL
System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 256KB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Artix-7 A200T
-
-
32MB
256KB
SO-DIMM-204
2.700" L x 2.000" W (68.00mm x 51.00mm)
0°C ~ 85°C
TE0715-04-71I33-L
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7030)
125MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0745-02-71I11-AK
Trenz Electronic GmbH

IC MOD SOM DDR3L 1GB ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM® Cortex®-A9
Zynq-7000 (Z-7030)
-
64MB
1GB
Samtec ST5
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0820-05-2AE21MA
Trenz Electronic GmbH

MOD MPSOC ZU2CG-1E 2GB DDR4 IND

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Pin(s)
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
-
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
TE0808-05-BBE81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
TE0813-02-3BE81-A
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0807-03-7AI21-A
Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Zynq UltraScale+ XCZU7CG-1FBVB900I
-
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0712-03-72C36-L
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 XC7A100T-2C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
Artix-7 XC7A100T-2C
-
-
32MB
1GB
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
TE0808-05-9BE81-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
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