Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Paquete: 689-BBGA Exposed Pad |
En existencias4.992 |
|
2 Core, 32-Bit | 800MHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC85XX 1.2GHZ 1023FCBGA
|
Paquete: 1023-BFBGA, FCBGA |
En existencias3.488 |
|
2 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 1023BGA
|
Paquete: 1023-BFBGA, FCBGA |
En existencias4.560 |
|
2 Core, 32-Bit | 1.333GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
Paquete: 783-BBGA, FCBGA |
En existencias2.368 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
Paquete: 689-BBGA Exposed Pad |
En existencias3.008 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 266MHZ 256BGA
|
Paquete: 256-LBGA |
En existencias4.624 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-CABGA (17x17) |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
Paquete: 672-LBGA |
En existencias3.792 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
Paquete: 516-BBGA |
En existencias7.328 |
|
1 Core, 32-Bit | 333MHz | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 266MHZ 740TBGA
|
Paquete: 740-LBGA |
En existencias6.000 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
Paquete: 672-LBGA |
En existencias4.624 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
Paquete: 672-LBGA |
En existencias5.584 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC74XX 1.0GHZ 360FCCBGA
|
Paquete: 360-BCBGA, FCCBGA |
En existencias2.112 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias4.880 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
Microchip Technology |
IC MPU POWERPC 300MHZ 360BGA
|
Paquete: 360-BBGA Exposed Pad |
En existencias3.456 |
|
1 Core, 32-Bit | 300MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - | 360-BBGA Exposed Pad | 360-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias5.456 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias3.792 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
|
Paquete: 1295-BBGA, FCBGA |
En existencias2.640 |
|
2 Core, 64-Bit | 2.0GHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 1 Gbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias6.304 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX6D 800MHZ 624FCBGA
|
Paquete: 624-FBGA, FCBGA |
En existencias7.504 |
|
2 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC82XX 200MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias7.056 |
|
1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
I.MX6 32BIT MPU 800MHZ 400MAPBGA
|
Paquete: 400-LBGA |
En existencias3.664 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, LPDDR3 | Yes | EPDC, LCD | - | - | USB 2.0 OTG + PHY (2) | 1.2V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS | 400-LBGA | 400-BGA (14x14) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
Paquete: 516-BBGA |
En existencias4.320 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU I.MX25 400MHZ 400MAPBGA
|
Paquete: 400-LFBGA |
En existencias6.600 |
|
1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -20°C ~ 70°C (TA) | - | 400-LFBGA | 400-MAPBGA (17x17) |
||
NXP |
I.MX 6S ROM PERF ENHAN
|
Paquete: 624-LFBGA |
En existencias4.528 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
STMicroelectronics |
TFBGA11SQX1.2 256 F1
|
Paquete: - |
En existencias6.192 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Paquete: 624-LFBGA |
En existencias7.440 |
|
1 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
NXP |
I.MX 6SL ROM PERF ENHAN
|
Paquete: 432-TFBGA |
En existencias4.912 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | 0°C ~ 95°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 432-TFBGA | 432-MAPBGA (13x13) |
||
Microchip Technology |
BGA GREEN, IND TEMP,MRLB
|
Paquete: 361-TFBGA |
En existencias10.764 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 361-TFBGA | 361-TFBGA (16x16) |
||
NXP |
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Paquete: 624-LFBGA |
En existencias10.368 |
|
2 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
STMicroelectronics |
MPU WITH ARM DUAL CORTEX-A7 650
|
Paquete: - |
En existencias7.264 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |