Página 876 - NXP Productos | Heisener Electronics
Contáctenos
SalesDept@heisener.com 86-755-83210559-843
Iniciar sesión/Registrar
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Carro 0

NXP Productos

Registros 26.590
Página  876/887
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
PHP73N06T,127
NXP

MOSFET N-CH 60V 73A TO220AB

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 60V
  • Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 54nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 2464pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 166W (Tc)
  • Rds On (Max) @ Id, Vgs: 14 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: TO-220AB
  • Package / Case: TO-220-3
Paquete: TO-220-3
En existencias4.432
PHD3055E,118
NXP

MOSFET N-CH 60V 10.3A DPAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 60V
  • Current - Continuous Drain (Id) @ 25°C: 10.3A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 5.8nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 250pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 33W (Tc)
  • Rds On (Max) @ Id, Vgs: 150 mOhm @ 5.5A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: DPAK
  • Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Paquete: TO-252-3, DPak (2 Leads + Tab), SC-63
En existencias7.328
MRFE6VP6300HR3
NXP

FET RF 2CH 130V 230MHZ NI780-4

  • Transistor Type: LDMOS (Dual)
  • Frequency: 230MHz
  • Gain: 26.5dB
  • Voltage - Test: 50V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 100mA
  • Power - Output: 300W
  • Voltage - Rated: 130V
  • Package / Case: NI-780-4
  • Supplier Device Package: NI-780-4
Paquete: NI-780-4
En existencias6.192
BFU530WF
NXP

TRANS RF NPN 12V 40MA SOT-323

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 12V
  • Frequency - Transition: 11GHz
  • Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
  • Gain: 12.5dB
  • Power - Max: 450mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
  • Current - Collector (Ic) (Max): 40mA
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-70, SOT-323
  • Supplier Device Package: SOT-323-3
Paquete: SC-70, SOT-323
En existencias6.752
N74F374N,602
NXP

IC D-TYPE POS TRG SNGL 20DIP

  • Function: Standard
  • Type: D-Type
  • Output Type: Tri-State, Non-Inverted
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Clock Frequency: 165MHz
  • Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 3mA, 24mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Iq): 86mA
  • Input Capacitance: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
Paquete: 20-DIP (0.300", 7.62mm)
En existencias6.336
TDA18274HD/C1,557
NXP

IC TUNER TERR/CATV 48HLQFN

  • Type: Tuner
  • Applications: TV
  • Mounting Type: Surface Mount
  • Package / Case: 48-LFQFN Exposed Pad
  • Supplier Device Package: 48-HLQFN (7x7)
Paquete: 48-LFQFN Exposed Pad
En existencias6.080
TDA20140/2,518
NXP

IC HDMI INTERFACE 28-HVQFN

  • Type: Interface
  • Applications: Video
  • Mounting Type: Surface Mount
  • Package / Case: 28-VFQFN Exposed Pad
  • Supplier Device Package: 28-HVQFN (5x5)
Paquete: 28-VFQFN Exposed Pad
En existencias7.248
SC16C751BIBS,128
NXP

IC UART SINGLE W/FIFO 24-HVQFN

  • Features: -
  • Number of Channels: 1, UART
  • FIFO's: 64 Byte
  • Protocol: -
  • Data Rate (Max): 5Mbps
  • Voltage - Supply: 2.5V, 3.3V, 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
Paquete: 24-VFQFN Exposed Pad
En existencias7.776
hot MCZ33661EFR2
NXP

IC LIN INTERFACE PHYSICAL 8-SOIC

  • Type: Transceiver
  • Protocol: LIN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 175mV
  • Data Rate: 20kbps
  • Voltage - Supply: 6 V ~ 18 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
Paquete: 8-SOIC (0.154", 3.90mm Width)
En existencias105.552
74HC4052D/AUJ
NXP

IC MUX/DEMUX DUAL 4X1 16SOIC

  • Switch Circuit: SP4T
  • Multiplexer/Demultiplexer Circuit: 4:1
  • Number of Circuits: 2
  • On-State Resistance (Max): 130 Ohm
  • Channel-to-Channel Matching (ΔRon): 4 Ohm
  • Voltage - Supply, Single (V+): 2 V ~ 6 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 34ns, 32ns
  • -3db Bandwidth: -
  • Charge Injection: -
  • Channel Capacitance (CS(off), CD(off)): 10pF
  • Current - Leakage (IS(off)) (Max): 1µA
  • Crosstalk: -50dB @ 1MHz
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paquete: 16-SOIC (0.154", 3.90mm Width)
En existencias3.040
KMPC8555EPXALF
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: Communications; CPM, Security; SEC
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
Paquete: 783-BBGA, FCBGA
En existencias7.152
MC9S08SE8MTG
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: LIN, SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 14
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
Paquete: 16-TSSOP (0.173", 4.40mm Width)
En existencias5.232
MCF52233CVM60
NXP

IC MCU 32BIT 256KB FLASH 121BGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 60MHz
  • Connectivity: Ethernet, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 73
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 121-LBGA
  • Supplier Device Package: 121-MAPBGA (12x12)
Paquete: 121-LBGA
En existencias3.376
SPC5602PEF0VLL6
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 16
  • RAM Size: 20K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
Paquete: 100-LQFP
En existencias5.776
MC9S08SE8VTG
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: LIN, SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 14
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
Paquete: 16-TSSOP (0.173", 4.40mm Width)
En existencias6.480
S9S08SG4E2CSC
NXP

IC MCU 8BIT 4KB FLASH 8SOIC

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 4
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
Paquete: 8-SOIC (0.154", 3.90mm Width)
En existencias7.472
hot MC908GR16ACFAE
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 37
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP
En existencias156.744
MK10DX32VLH5
NXP

IC MCU 32BIT 32KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 44
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 19x16b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paquete: 64-LQFP
En existencias7.616
SPAKDSP303VF100
NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

  • Type: Fixed Point
  • Interface: Host Interface, SSI, SCI
  • Clock Rate: 100MHz
  • Non-Volatile Memory: ROM (576 B)
  • On-Chip RAM: 24kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 196-LBGA
  • Supplier Device Package: 196-MAPBGA (15x15)
Paquete: 196-LBGA
En existencias3.664
MF3MOD4101DA4/04,1
NXP

IC DESFIRE EV1 4K EEPROM PLLMC

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: UART
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: MOA4, Smart Card Module
  • Supplier Device Package: PLLMC
Paquete: MOA4, Smart Card Module
En existencias2.538
TWR-KW24D512
NXP

TOWER SYSTEM KIT

  • Type: Transceiver; 802.15.4
  • Frequency: 2.4GHz
  • For Use With/Related Products: KW2x
  • Supplied Contents: Board, Cable
Paquete: -
En existencias6.084
BGU7051,118
NXP

IC AMP LNA FOR WIRELESS 10HVSON

  • Frequency: 500MHz ~ 1.5GHz
  • P1dB: 16.5dB
  • Gain: 21dB
  • Noise Figure: 0.65dB
  • RF Type: General Purpose
  • Voltage - Supply: 3 V ~ 3.6 V
  • Current - Supply: 65mA
  • Test Frequency: 900MHz
  • Package / Case: 10-VFDFN Exposed Pad
  • Supplier Device Package: 10-HVSON (3x3)
Paquete: 10-VFDFN Exposed Pad
En existencias6.480
LS1021AXE7KQB
NXP

LS1 32BIT ARM SOC 1GHZ DDR3/4

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
Paquete: 525-FBGA, FCBGA
En existencias5.536
FS32K144UAT0MLHT
NXP

S32K144 32-BIT MCU, ARM

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 112MHz
  • Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paquete: 64-LQFP
En existencias5.968
SPC5775EDK3MME3R
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Dual-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: 293
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 40x12b eQADCx2
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
Paquete: 416-BGA
En existencias3.968
S32K310NHT0VPAST
NXP

IC MCU 32BIT 512KB FLASH 100QFP

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
  • Peripherals: DMA, I2S, WDT
  • Number of I/O: 84
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 112K x 8
  • Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-QFP
  • Supplier Device Package: 100-MaxQFP (10x10)
Paquete: -
Request a Quote
SAF4000EL-101Z275K
NXP

SAF4000EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote
LX2160CC72232B
NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCPBGA (40x40)
Paquete: -
Request a Quote
MIMX8DX6GVLFZAC
NXP

I.MX 8X FIPS

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
  • Number of Cores/Bus Width: 3 Core, 64-Bit
  • Speed: 1.2GHz, 264MHz
  • Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
  • Package / Case: 609-BFBGA
  • Supplier Device Package: 609-FBGA (21x21)
Paquete: -
Request a Quote
MC68EC040RC33A-NXP
NXP

MICROPROCESSOR, 32 BIT, MC68000

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote