Based on proven Allegro and OrCAD core technologies, the new platform revolutionizes the system design process for engineers, provides superior overall engineering discipline collaboration, integrates best-in-class Cadence Signoff-level simulation and analysis products, and superior layout performance. Cadence Design Systems has launched the Cadence Allegro X Design platform, the industry's first Systems Design engineering platform that integrates schematics, analysis, layout, Design collaboration and data management.
Today's engineers often must design and collaborate in multiple areas, including EM, thermal, SI/PI, and logical/physical implementations. The platform's simplified user interaction model provides quick technology access and immediate value for novice and expert users. By reducing iteration and providing access to logical and physical domains and concurrent collaboration across schematics, layout, and analysis activities, the platform reduces the time and effort to develop complex system designs by up to four times compared to traditional design tools.
With the platform, engineers can now deliver high-quality designs using Cadence Clarity 3D solver, Celsius Heat Solver, Sigrity technology and PSpice for simulation and analysis, Allegro Pulse for design data management, And interoperability with AWR Microwave Office RF design process. The platform employs a hybrid cloud solution that provides scalable computing resources and complete technology access while reducing deployment footprint and complexity
The innovative ML technology simultaneously optimizes the design of manufacturing, SI and PI requirements, as well as the design of PDN, equipment placement and signal interconnection as specified by the system architect/Electrical engineer. The Allegro X platform offers significant improvements in design throughput and performance. Performance is accelerated across a wide range of operations using GPU technology and core architecture optimization. In addition, Allegro X platform leverages cloud resources to synthesize all or part of PCB designs.
Tom Beckley, senior vice president and general manager of the Custom IC and PCB Group at Cadence said:“The Allegro X platform establishes a unified engineering platform that increases overall design team productivity by a factor of 4. Engineers now have a logical and physical design framework in 2D or 3D, single- or multi-board, through integration with AWR Microwave Office RF The interoperability of the design flow allows them to optimize resources even in the most complex 5G designs," "Cadence R&D has been working with academia and industry partners on groundbreaking, analysis-driven PCB synthesis that has greatly improved design productivity."
"Cadence's Allegro X platform is capable of delivering interactive performance up to 20X by using an NVIDIA GPU," said Greg Bodi, NVIDIA PCB Layout engineering director. "During the design phase, when our engineers draw complex 2D boards, this performance improvement provides immediate responsiveness and acceleration of the canvas."
Dr. Thomas Palacios, a professor of electrical engineering and computer science at MIT Said:"Multi-objective optimization is a challenging problem, and I am pleased that MIT students and alumni have made significant progress in their work within Cadence on a new ML solution for synthesizing difficult PCB designs. The resulting system will not only benefit MIT, but will also significantly increase the overall productivity of the PCB community."
