Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SER CONFIG 1M 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias2.896 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 1M CONFIG MEM 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.520 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias4.480 |
|
400kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias6.336 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
Paquete: 8-TDFN |
En existencias3.552 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias6.832 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 32TQFP
|
Paquete: 32-TQFP |
En existencias4.256 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SER 2MBIT 3.3V 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias5.328 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC 3V PROM SER 300K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias6.480 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias5.376 |
|
100kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.376 |
|
50kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias203.700 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias45.948 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 128KB 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias3.760 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias7.056 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC SERIAL CFG PROM 256K 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias11.940 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 88UBGA
|
Paquete: 88-LFBGA |
En existencias19.776 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
Paquete: 32-TQFP |
En existencias3.984 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Altera |
IC CONFIG DEVICE 100QFP
|
Paquete: 100-BQFP |
En existencias4.800 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 128MBIT 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias2.416 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Xilinx Inc. |
IC CONFIG PROM 4MBIT 44TQFP
|
Paquete: 44-TQFP |
En existencias11.880 |
|
4Mb | 3 V ~ 3.6 V | -55°C ~ 125°C | 44-TQFP | 44-VQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 8MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias32.640 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
Paquete: 24-TBGA |
En existencias6.936 |
|
512MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias92.268 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 88UBGA
|
Paquete: 88-LFBGA |
En existencias6.368 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 32TQFP
|
Paquete: 32-TQFP |
En existencias5.856 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 212KBIT 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.632 |
|
212kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
Paquete: 32-TQFP |
En existencias12.192 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |