Página 26 - Microsemi Corporation Productos - Integrado - Sistema en chip (SoC) | Heisener Electronics
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Microsemi Corporation Productos - Integrado - Sistema en chip (SoC)

Registros 761
Página  26/26
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
M2S090-1FG676IX417
Microsemi Corporation

IC FPGA SOC 90K LUTS 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias3.744
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 90K Logic Modules
-40°C ~ 100°C (TJ)
-
-
M2S150TS-1FCG1152M
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias3.168
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-55°C ~ 125°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S150TS-1FC1152M
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias4.528
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-55°C ~ 125°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S150T-1FCG1152M
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias5.200
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-55°C ~ 125°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S150T-1FC1152M
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias5.664
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-55°C ~ 125°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
A2F500M3G-FGG256M
Microsemi Corporation

IC FPGA 500K GATES 512KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
Paquete: 256-LBGA
En existencias7.168
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F500M3G-FG256M
Microsemi Corporation

IC FPGA 500K GATES 512KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
Paquete: 256-LBGA
En existencias4.864
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F500M3G-1FG256M
Microsemi Corporation

IC FPGA 500K GATES 512KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
Paquete: 256-LBGA
En existencias2.864
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-FGG256M
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
Paquete: 256-LBGA
En existencias3.248
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-FG256M
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
Paquete: 256-LBGA
En existencias2.416
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-1FGG256M
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
Paquete: 256-LBGA
En existencias5.280
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-55°C ~ 125°C (TJ)
256-LBGA
256-FBGA (17x17)