Infineon Technologies AG has partnered with pmd, which specializes in 3D ToF (time-of-flight) systems, to develop the second-generation automotive REAL3™ image sensor, which is ISO26262 compliant and has higher resolution . Housed in a 9 x 9 mm² plastic BGA (Ball Grid Array) package, the sensor achieves a VGA system resolution of 640 x 480 pixels using a tiny photosensitive area of only 4 mm.
To deal with quantum computing will have a significant impact on network security, to ensure the confidentiality of encrypted data and the integrity of digital signatures brought threats. Infineon Technologies inc. has introduced the new OPTIGA™ TPM (Trusted Platform Module) SLB 9672 to further enhance system security. The TPM chip is a forward-looking security solution.
Infineon's AIROC CYW20820 Bluetooth and Low Power Bluetooth ® on-chip systems enable flexible, low power and high performance connectivity
Radar sensors can be used in smart homes and smart health management, ToF sensors can also be used to monitor falls, and carbon dioxide sensors can be used with air conditioners, air purifiers, and other home appliances to detect carbon dioxide concentrations. Infineon is breaking new ground in the new field of smart health management by providing sensors and in-house algorithms, together with partners.
Infineon Technologies AG and 3D ToF system specialist pmdtechnologies AG have jointly developed the second generation of the REAL3 automotive image sensor – a high-resolution 3D image sensor according to the iso26262 standard. The sensor is housed in a 9mm x 9mm² plastic BGA package and offers a VGA system resolution of 640 x 480 pixels and a tiny 4mm image circle. In addition to safety-critical applications, 3D data enables comfort features such as gesture control or intuitive interior lighting to track passenger movements
Infineon Technologies inc. has released the new 1700 V TRENCHSTOP™ IGBT7 module in the EconoDUAL™ 3 standard industrial package. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings to further extend the power range of the inverter. The module can be widely used in wind power, motor drive and static reactive power generator (SVG) applications.
XENSIV™ PAS CO2 sensors can be used in air conditioning systems or air quality monitors for targeted air quality control. This method helps to improve human health and improve work efficiency. Scientific studies have found that indoor carbon dioxide levels as low as 1,000 parts per million (PPM) can make people drowsy and impair concentration.
Infineon Technologies Inc. has introduced the next generation XENSIV MEMS microphone, defining a new industry standard. Microphones are used to capture audio signals with the highest accuracy and quality. The analog microphone IM73A135 delivers the industry's best 73dB(a) SIGNal-to-noise ratio and excellent 135dB SPL AOP. Its digital version, IM72D128, offers 72dB(A) signal-to-noise ratio and 128dB SPL AOP. The IM69D127 offers similar performance in a small 3.6mm x 2.5mm2 package
Infineon's new CAPSENSE solution, integrated into PSoC™ microcontrollers, delivers enhanced performance and lower power consumption for demanding user interfaces such as home appliances, industrial, consumer and Internet of Things products. Enhanced HMI improves detection range, gesture detection and directivity, and adds hover detection for future advanced touch screens, enabling advanced solutions such as proximity sensing.
Infineon continues to help customers succeed in the ever-changing consumer electronics market with products such as advanced sensors, microcontrollers, power semiconductors and security. During CES, Infineon launched a number of the latest products and solutions for future mobility and a safer and smarter Internet of Things.
How Infineon's leading product portfolio makes the smart home smarter, connected and secure under the Matter standard.
Infineon Technologies inc. has announced the launch of a complete power management solution for computing servers based on Intel's Sapphire Rapids processor (CPU)
Infineon's three MEMS microphones provide crystal clear audio pickup for the quietest and loudest sounds. Combined with selectable power modes, the high-performance XENSIV IM73A135, IM72D128 and IM69D127 microphones are ideal for consumer electronics
A new ferroelectric RAM (FRAM) memory chip claims to overcome two major challenges facing space design: radiation and limited power. Infineon Technologies LLC, part of Infineon Technologies AG, which focuses on memory solutions, claims that its new serial interface FRAM has an inherently radiation-resistant memory cell.
Intel continues to support its foundry business while making a concerted effort to get the company back on track to deliver leading-edge silicon processes to fabless customers. Like IC design, EDA and IP industries are integral parts of the IC manufacturing ecosystem; And fabs take the lead.
Infineon Technologies AG extends the LITIX Power line with the dual-channel, standalone DC-DC controller TLD6098-2ES. As a multi-topology controller, it supports boost, buck, SEPIC, and flyback topologies with wide input voltage ranges from 4.5V to 60V and even 24V battery system applications.
Infineon Technologies Bipolar GmbH & Co. KG extends the high power Prime Switch range with a new laminated IGBT (PPI) with FWD inside ceramic disc housing. At 3000A without FWD, the blocking voltage is 4.5kV. With FWD, the blocking voltage is 2000A. PPI enclosures are sealed and specially developed to withstand system induced failures.
Infineon Technologies currently offers the new TRENCHSTOP 1700V IGBT7 chip in the standard industrial package EconoDUAL 3. Compared to previous IGBT4 chipset modules, FF900R17ME7_B11 with this chip can achieve up to 40% inverter output current at the same package size. The new module also provides significantly lower static and dynamic losses, while addressing the application of static losses that are common in diode chips
