Feiling Technology Co., LTD has launched a new battery management IC series, including TLE9012DQU and TLE9015DQU. The new battery management IC is a competitive system-level solution for battery module, battery to battery pack, and battery to vehicle battery topology. The device is suitable for a wide range of industrial, consumer and automotive applications such as MHEV, HEV, PHEV and BEV. TLE9015DQU is a battery monitoring transceiver IC used to connect several TLE9012DQU devices within the Daisy chain of lithium ion batteries.
Infineon Technologies has released a new CoolSiC technology: the CoolSiC MOSFET 1200V M1H. Recent advances in CoolSiC base technology allow for an exceptionally large gate operating window, increasing the on resistance for a given die size. The device will be integrated into the Easy family, further enhancing the Easy 1B and 2B modules. In addition to the Easy module family, the M1H portfolio includes new ultra-low pass resistors of 7mOhm, 14mOhm and 20mOhm in to247-3 and TO247-4 discrete packages
Infineon Technologies has introduced a complete compute server power management system based on the Intel Sapphire Rapids CPU. The XDP Ultra-transient phase XDPE152 series controllers are based on the ultra-low-power Arm Cortex-M0 for maximum flexibility and optimized performance across workloads and ultra-fast dynamic load response times. The TDA215xx series OptiMOS integrated power class leverages industry's best OptiMOS 6 technology to deliver superior efficiency (& GT; 95%) and reliability, significantly reducing system cooling and maintenance costs.
Infineon Power Simulation Platform (IPOSIM) is a power simulation platform launched by Infineon Technologies Inc., which provides analysis of individual operating points and user-defined load profiles. A total of 19 disk and module topologies are provided, grouped by power conversion type. A user-friendly GUI was created to guide the designer through a step-by-step process of simulation of electrical equipment. With these features, it helps to select the right high-power product according to the needs of the application.
Infineon Technologies has launched the EDT2 IGBT in TO247PLUS package. The device optimizes discrete traction inverters for automobiles and expands the portfolio of discrete high voltage devices for automotive applications. Rated current 120A and 200A, the discrete EDT2 IGBT has very low forward voltage at 100C and can reduce on-loss by up to 13% compared to the previous generation. In addition, EDT2 IGBT provides a very narrow parameter distribution.
Infineon Technologies Co., LTD has launched the F3 Enhanced (1ED332x) series independent EiceDRIVER enhanced gated drive. The unit is installed in a 300mil wide-body DSO 16 package with a significant leakage distance of 8mm. Single-channel isolated gate drivers have CMTI of up to 300kV/us and typical output current of up to 8.5a. Devices are created for a wide power range and support an absolute maximum output voltage of 40V
Infineon Technologies Inc. now offers the MERUS dual-channel, analog input, Class D Audio Amplifier Multi-chip Module (MCM) MA5332MS. The device comes in a compact 7mm x 7mm2 42-pin QFN package that integrates a two-channel PWM controller, a high-voltage gate driver, and four low R DS(ON) MOSFEts. As a highly integrated MCM, it also contains a protection circuit, with over current, over temperature self-reset under voltage protection
Infineon Technologies ag has launched a new generation of AURIX MCU family products, the TC4x family promotes trends in mobile, ADAS, automotive E/E architectures and affordable AI applications. AURIX has established itself as an automotive architecture for high growth and safety-critical applications, including powertrain, safety, assist and autonomous driving, and domain or area control. Its scalable home concept is an important part of reliable electronic and software-based applications.
Infineon technologies has created a security solution for automotive wireless charging: The OPTIGA Trust Charge vehicle complies with version 1.3 of the WPC Qi standard, which requires strong password authentication of up to 15W for wireless charging. And is an embedded security solution with WPC-compatible supply and undo services, as well as compliance with Qi 1.3 encryption features such as ECDSA, NIST-P256 and SHA-256, and also allows manufacturers of wireless chargers or dedicated subsystems to do a quick and simple design according to the latest Qi security requirements
ICL88xx series of adapters and chargers, flat screen TV, all-in-one and gain up to 125W display. All three solutions provide benchmark performance for PFC and total harmonic distortion under full load and low load conditions, facilitating platform designs and window drivers. The series offers external start circuit control signals, a bottom-up platform design for greater flexibility and cost optimization, and also offers a comprehensive set of protection features. The series provides external start circuit control signals for greater flexibility
The TomTom GO Discover is considered one of the fastest and most powerful satellite navigation systems on the market today. The satellite navigation has 5 ", 6 "and 7" displays and utilizes infineon's AIROC CYW43455 Wi-Fi and Bluetooth combination chip. The wireless solution integrates wi-Fi-5 (802.11AC) and Bluetooth 5.0 on a single chip, providing fast and robust wireless connectivity critical to navigation devices and enabling reliable, high-performance connectivity.
Applications including e-scooters, e-forklifts and other LEVs, as well as power tools and battery management systems, necessitate high current rating, ruggedness and extended lifetime. Infineon Technologies AG answers these demands by providing more choices to power system designers to satisfy diverse design requirements and deliver maximum performance in the smallest space.
Infineon's growing portfolio of single-channel door drive ics now includes the new EiceDRIVER 1EDB single-channel door drive ICS family, providing 3kVrms (UL 1577) of current input-output isolation. The new series consists of four sections (1EDB6275F, 1EDB7275F, 1EDB8275F and 1EDB9275F) and is optimized for high/low side applications. All products offer independent and very low ohm (0.95 ohms) sources and (0.48 ohms)sink outputs for ease of design, providing the typical drive strength of 5.4a peak source and 9.8A peak sink
Infineon Technologies has introduced a simple backpack with automotive performance 2B EDT2, a flexible, retractable half-bridge power module. Another unique feature of this module is the plug-and-play approach, which simplifies module integration.
Infineon Technologies AG has launched its SECORA Pay payment solution based on the latest 40nm technology platform. The plug and play solution draws on extensive expertise in contactless payment technology and uses its SOLID FLASH chip platform. Offers components including new applets and custom value-added products standard payment cards (SECORA Payment S), as well as multi-application cards (SECORA Payment X) and off-the-shelf solutions
To meet the growing demand for high reliability memory, Infineon Technologies has announced the industry's first high-density RadTol NOR flash product that conforms to the MIL-PRF-38535 QML-V process (QML-V equivalent). The 256Mb and 512Mb RadTol NOR Flash non-volatile memory provides superior, low-pin number, single-chip solutions for applications including FPGA configuration, image storage, microcontroller data, and startup code storage. The device can be programmed in the system via FPGA or standalone programmer and is offered in the same 36-lead ceramic flat package
Infineon Technologies has launched the industry's first high-voltage MCU supporting USBPD 3.1. Ez-pd PMG1 (Power Delivery Microcontroller Gen1) is the company's first GENERATION USB PD MCU and supports higher Power capabilities as defined in the USB PD 3.1 specification. The series also integrates a market-proven USB PD stack to promote reliable performance and interoperability. Help consumers make their daily lives easier, safer and more environmentally friendly
Infineon Technologies and Panasonic Have signed an agreement to jointly develop and produce their second generation (Gen2) GaN technology, providing higher efficiency and power density levels. The equipment will provide ease of use and improved cost performance targeting high and low power SMPS applications, renewable energy, motor drive applications and more.
