Infineon Technologies Bipolar GmbH & Co. KG is further expanding its high-power Prime Switch product lineup with the launch of new opt-on IGBT (PPI) in ceramic plate package with internal continuous current diode (FWD). Designed for transmission and distribution applications, the PPI is ideal for high-current modular multilevel converters (MMCS), medium-voltage drivers, DC grid circuit breakers, wind power converters, and traction systems
Infineon Technologies has released the new 1700 V TRENCH STOP™ IGBT7 module in EconoDUAL™ 3 standard industrial packaging. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings, further extending the inverter's power range. The module can be widely used in wind power, motor drive, static reactive power generator (SVG) and other applications.
Infineon Technologies AG has launched the new XENSIV™ PAS CO2 Shield2Go evaluation board for air quality monitoring and on-demand ventilation control to help achieve energy savings. This new evaluation board is part of Infineon's Shield2Go product portfolio. The product portfolio covers sensors, microcontrollers and safety ICs, which can be freely combined as part of integrated prototyping.
The XENSIV™ automotive millimeter-wave radar sensor (BGT60ATR24C) launched by Infineon Technologies is applied to the Intelligent Cockpit Monitoring System (ICMS), which can detect the slight movements and vital signs of babies and animals left in the car, and sound an alarm. In addition, this small, cost-effective chipset can be used for gesture sensing in front-end radars, high-resolution frequency modulated continuous wave (FM CW) radar ranging, proximity sensing operations, and covert sensing in radomes, among many others. application.
The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Pinjia has launched a 60W high-efficiency ultra-low standby power supply solution based on Infineon's ICE5GSAG device.
Infineon Technologies AG has combined the hybrid flyback (HFB) controller, XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs.
Infineon has announced the WLC1115 transmitter controller IC, the first product in the new WLC line of controllers, which uses inductive wireless charging technology. In addition, Infineon offers a WLC1115-based and Qi V1.3.2 certified MP A11 wireless charging transmitter reference design solution that can be used in a variety of applications such as smartphones, smart speakers, docking stations, display holders, industrial or medical device accessories.
Infineon Technologies AG has released an innovative solution that integrates a hybrid flyback (HFB) controller XDP™ digital power controller with a 600 V CoolGaN™ integrated power stage (IPS) product (IGI60F1414A1L) , which can be used to design energy-efficient, high-power-density chargers and adapters.
In the future, keys will be a thing of the past in many areas of people's daily lives. Infineon Technologies AG will bring to the market a smart lock solution that can be opened and closed via a mobile phone. The smart lock requires no batteries and can be wirelessly charged using a mobile phone, a technique known as "energy harvesting".
Infineon has developed a 32-bit programmable microcontroller based on the ARM® Cortex®-M0 core, and the NAC1080 MCU has an NFC interface that can directly control the device through a smartphone. Advanced on-premises and cloud capabilities are extensible in mobile apps provided by regional marketing partners. This helps customers reduce BOM cost and supports miniaturized design of products.
Infineon technologies inc. has introduced efficient and reliable DC-DC buck converter modules to further expand its POL (load power) module lineup. These modules are ideal for system designers who want POL products that are compact, fully integrated, and easy to design to help them speed new products to market.
Infineon Technologies ag and Oxford Ionics announced that they will work together to create a fully integrated high-performance quantum processor (QPU). Oxford Ionics' unique electronic qubit control (EQC) technology, combined with Infineon's global leading engineering, manufacturing capabilities and technical expertise in quantum technology, will lay the foundation for the industrial production of quantum processors with hundreds of qubits within the next five years.
Infineon Technologies and Delta Electronics, two global electronics companies with a long history of innovative semiconductor and power electronics, announced the deepening of their cooperation to enhance the application of wide-band gap SiC and GaN devices in high-end power products to provide outstanding solutions to end customers.
Infineon Technologies AG presents fully programmable motor controllers MOTIX™ IMD700A and IMD701A. Available in a 9 x 9 mm2 64-pin VQFN package, they enable wireless power tools, garden supplies, drones, e-bikes, and automated guided vehicles with higher levels of integration and power density to meet user needs.
Infineon technologies, a global leader in semiconductor solutions, has collaborated with Aqara Greenmi, a leader in whole-house intelligence, to launch a cost-effective and complete smart home human presence solution, namely the Aqara human presence sensor FP1.
Infineon Technologies, a global leader in semiconductor solutions, signed a cooperation agreement with RT-Thread, a well-known IoT operating system manufacturer, and became a gold member of the RT-Thread open source community. Infineon will provide developers in the RT-Thread ecosystem with innovative solutions from products to systems with its technical expertise in core IoT areas such as perception, computing, execution, connectivity, and security.
Infineon Technologies AG has released a new CoolSiC™ technology, the CoolSiC™ MOSFET 1200 V M1H. This advanced silicon carbide (SiC) chip is used in the popular Easy module family, as well as in discrete packages based on .XT interconnect technology, with a very broad product portfolio.
Infineon Technologies inc. has introduced CIPOS Tiny IM323-L6G 600 V 15 A to further expand its LINEUP of CIPOS™ Tiny Intelligent Power Modules (IPM). The new IPM uses TRENCHSTOP™ RC-D2 IGBT power switches and advanced SOI gate drive technology to maximize efficiency and reliability while minimizing the size and cost of the system.
